Overview

High-speed optical modules rely on DSP, TIA, laser drivers, and silicon photonics integration for density and efficiency. COBO and CPO tightly couple optics with switch ASICs to reduce board losses and improve system power.

Key Topics

• DSP equalization and FEC, TIA gain/noise
• Silicon photonics coupling, modulators, integration challenges
• CPO/COBO ecosystem, serviceability, thermal and interoperability